Apple’s persistent quest for better performance, longer battery life, and slimmer form factors appears to be driving its research into advanced chip packaging technologies. So-called “2.5D” and “3D” packaging methods stand to offer significant gains in all of these areas by increasing memory bandwidth, reducing power consumption, and freeing up space for higher-capacity batteries.
Apple has been an aggressive adopter of new device packaging methods, mostly thanks to integrated fan-out (InFO) innovations provided by foundry partner TSMC. TSMC’s success has spurred it into further developing and diversifying its packaging offerings, and TSMC has emerged as an industry leader in packaging techniques.
Källa: Patent Applications Reveal Apple’s Research Into 3D Chip Packaging
